AKSÖZ, S. Et Al. 2022. Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.33, no.1 , 11-26.

AKSÖZ, S., Esener, P. A., ÖZTÜRK, E., & Marasli, N., (2022). Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.33, no.1, 11-26.

AKSÖZ, SEZEN Et Al. "Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems," JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.33, no.1, 11-26, 2022

AKSÖZ, SEZEN Et Al. "Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems." JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.33, no.1, pp.11-26, 2022

AKSÖZ, S. Et Al. (2022) . "Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems." JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , vol.33, no.1, pp.11-26.

@article{article, author={SEZEN AKSÖZ Et Al. }, title={Effects of Bi content on thermal, microstructure and mechanical properties of Sn-Bi-In-Zn solder alloy systems}, journal={JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS}, year=2022, pages={11-26} }