Effects of Minor Al, Ag, and Sb Additions on the Thermal, Microstructure and Microhardness of Zn-Sn-Cu-Bi High-Temperature Solder Alloys

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Aksoz S., Esener P. A., ÖZTÜRK E., MARAŞLI N.

PROTECTION OF METALS AND PHYSICAL CHEMISTRY OF SURFACES, cilt.60, sa.4, ss.723-733, 2024 (SCI-Expanded, Scopus)

• Yayın Türü: Makale / Tam Makale
• Cilt numarası: 60 Sayı: 4
• Basım Tarihi: 2024
• Doi Numarası: 10.1134/s2070205124701934
• Dergi Adı: PROTECTION OF METALS AND PHYSICAL CHEMISTRY OF SURFACES
• Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
• Sayfa Sayıları: ss.723-733
• Kocaeli Üniversitesi Adresli: Evet

Özet

In the present study, the changes in microstructure, thermal conductivity (K), melting properties and microhardness (HV) adding of 0.05 wt % Al, Ag and Sb into Zn-5Sn-2Cu-1.5Bi (ZSCB) high temperature solder alloy were investigated. The addition of trace amounts of Al, Ag and Sb caused a significant improvement in K and HV values. Addition of 0.05 wt % of Al and Ag into the ZSCB alloy increased the K and HV values by 62% and in the range of 19-21%, respectively. The addition of 0.05 wt % of Sb increased the K and HV values by 32 and 36%, respectively.