Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn-Ag-Cu High-Temperature Solder Alloys

Aksoz S., Ocal F., Esener P. A., ÖZTÜRK E., MARAŞLI N.

PHYSICS OF METALS AND METALLOGRAPHY, cilt.124, ss.1547-1554, 2023 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 124
  • Basım Tarihi: 2023
  • Doi Numarası: 10.1134/s0031918x22601974
  • Dergi Adı: PHYSICS OF METALS AND METALLOGRAPHY
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Compendex, INSPEC, Metadex
  • Sayfa Sayıları: ss.1547-1554
  • Kocaeli Üniversitesi Adresli: Evet

Özet

In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn-1 wt % Ag-0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb caused a significant improvement in microhardness while decreasing the melting temperature range, thermal conductivity and electrical conductivity. Addition of 0.5, 1, 1.5 wt % Sb to SAC105 alloy system decreased the thermal conductivity by 48% and electrical conductivity by 27%. The addition of Sb at the same rate increased the microhardness by 27%.