Akademik Veri Yönetim Sistemi
Journal of Energy Storage, cilt.70, 2023 (SCI-Expanded)
Modern electronics technologies have given great interest to phase change materials (PCMs). The present work is in line with this philosophy and deals with the effectiveness of a PCM-based heat sink and nanoparticles in insertion for thermal management of several electronic components. Present numerical study explores the solid-liquid phase change process of n-eicosane in an enclosure considered for cooling of electronics in the presence of one, two, and three protruding electronic components. To improve thermal management capability, four types of nanoparticles, namely, silver (Ag), magnesium oxide (MgO), multi-walled carbon nanotube (MWCNT), and silicon dioxide (SiO2), are inserted into the n-eicosane by single and hybrid ways at volume fractions ranging from 0 % to 4%, and by introducing a lateral fin playing the role of a motherboard. It should be noted that this study is interested in analysing the combined effects of the volume fraction of inserted nanoparticles ranging from 0 % to 4%, the type of inserted nanoparticles, and the number of electronic components installed at the heat sink on the overall heat transfer and flow structure of the fluid PCM. For this purpose, a mathematical model has been developed for the formulation of the governing equations of the conjugate natural convection. The enthalpy-porosity technique is applied for modelling the phase change process. Results reveal a significant relationship between the melting time and the operating temperature of the electronic component. A long phase change process is characterized by a high utilization of latent heat and subsequently the heat rejection becomes efficient. Hence, the longer melting times result in reduced operating temperatures. By insertion of SiO2-MWCNT hybrid nanoparticles, the melting time is increased by approximately 92 % compared to pure PCM, and the plateau temperature is mitigated by 11 °C by using one component in the enclosure. Furthermore, by increasing the number of electronic components, the flow structure, thermal field and melting front become more uniform. Thus, it can be recommended to use three electronic components with a lower heat generation rate instead of using one electronic component with three times higher heat dissipation in a PCM-based cooling system.