Thermal, electrical, and mechanical properties of Sn-Ag-Zn solder alloys for BGA packaging

Arı M., Aksöz S., Ata Esener P., ÖZTÜRK E.

Physica B: Condensed Matter, cilt.699, 2025 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 699
  • Basım Tarihi: 2025
  • Doi Numarası: 10.1016/j.physb.2024.416868
  • Dergi Adı: Physica B: Condensed Matter
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Academic Search Premier, PASCAL, Aerospace Database, Chemical Abstracts Core, Communication Abstracts, Compendex, INSPEC, Metadex, Civil Engineering Abstracts
  • Anahtar Kelimeler: BGA packaging, Electrical conductivity, Mechanical properties, Solder alloys, Thermal conductivity
  • Kocaeli Üniversitesi Adresli: Evet

Özet

This study aims to produce an alternative lead-free solder alloy, which is both low in cost and superior in terms of thermophysical properties, instead of tin-silver (Sn-Ag) solders, especially used in microelectronic devices. Therefore, in the tin-silver-zinc (Sn-Ag-Zn) alloy group, Sn-2 wt.%Ag-[X] wt.%Zn (X = 2, 2.5) and Sn-1.5 wt%Ag-[X] wt.%Zn (X = 2, 2.5) (X, formed by changing the amount of Zn) alloy systems’ thermal, electrical and mechanical properties which are important parameters for safety, especially in microelectronic devices and Ball Grid Array (BGA) packaging were investigated for the first time, depending on temperature and composition. In the Sn-2 wt.%Ag-[X] wt.%Zn (X = 2, 2.5) ve Sn-1.5 wt%Ag-[X] wt.%Zn (X = 2, 2.5) alloy groups, while the ideal alloy was Sn-1.5Ag-2Zn for thermal conductivity and electrical conductivity, the perfect alloy in terms of mechanical properties was determined to be Sn-2Ag-2Zn.