Ultrafine-grain formation and improved mechanical properties of novel extruded Ti-Fe-W alloys with complete solid solution of tungsten

Bahador A., Umeda J., YAMANOĞLU R. , Amrin A., Alhazaa A., Kondoh K.

JOURNAL OF ALLOYS AND COMPOUNDS, vol.875, 2021 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 875
  • Publication Date: 2021
  • Doi Number: 10.1016/j.jallcom.2021.160031


Thermomechanical processing and solid-solution strengthening are effective ways to improve the mechanical properties of Ti alloys with elements such as W and Fe. In this study, we present a novel extruded Ti-Fe-W alloys with improved mechanical properties. To analyze the effect of W on the mechanical properties and microstructure of the alloys, Ti-4Fe-xW (x = 0-3 wt%) alloys were prepared by spark plasma sintering followed by homogenization heat treatment and hot extrusion. The microstructure of the assintered specimens included undissolved W particles distributed in the acicular alpha + beta matrix. However, heat treatment at 1300 degrees C for 1 h led to the complete dissolution of W. After hot extrusion at 850 degrees C, an ultrafine equiaxed (globular) microstructure was observed, in which Fe and W preferentially diffused into the beta phase. The main effect of W on the microstructure was a remarkable grain refinement by activation of dynamic recrystallization and impediment of the grain boundary mobility in Ti-4Fe-(1-3)W (similar to 1 mu m) when compared to Ti-4Fe (similar to 3 mu m). Additionally, W increment resulted in a gradual decrease of the average size of a grains. The tensile yield strength increased as W content increased so that the Ti-4Fe-3W alloy exhibited a remarkably high tensile strength, yielding at similar to 1123 MPa with an elongation of similar to 26%. Finally, theoretical and experimental analyses suggested that grain refinement and solid-solution strengthening were the main mechanisms contributing to the strengthening phenomenon in W-containing alloys. (C) 2021 Elsevier B.V. All rights reserved.